Growth of Nb3Sn coating in tin vapor-diffusion process

Thickness Dependence of Sensitivity in Thin Film Tin Oxide Gas Sensors Deposited by Vapor Pyrolysis

Transparent SnO2 thin films were deposited on porcelain substrates using a chemical vapor deposition technique based on the hydrolysis of SnCl4 at elevated temperatures. A reduced pressure self-contained evaporation chamber was designed for the process where the pyrolysis of SnCl4 at the presence of water vapor was carried out. Resistive gas sensors were fabricated by providing ohmic contacts o...

Effect of Tin Coating of Abutment Screw on Detorque Force

Purpose. The aim of this study is to evaluate the effect of TiN coating of abutment screw on the unscrewing torque. Material and methods. Titanium and Gold-Tite abutment screws were classified into two groups, Group A and C respectively, as control groups. Titanium abutment screws with TiN coatings were also classified into two groups, Group B and D, as experimental ones. Group A and B were tig...

In-situ neutron diffraction study of a heating treatment for Nb3Sn ITER superconducting wires

In-situ powder neutron diffraction studies have been performed during the heating treatment of a set of Nb3Sn wires obtained by the internal tin process. The different phases appearing during the process have been evidenced. A strong reorientation of the deformed copper and niobium metals induces an orientation on the Nb3Sn formed. Among the phases formed, the δ-CuSn phase is decomposed at 890K...

Corrosion Behavior of TiN/CrN Nanoscale Multi-layered Coating in Ringer's Solution

In this article, corrosion behavior of the single-layered TiN, single-layered CrN and multi-layered TiN/CrN coatings have been fabricated on 420C stainless steel (SS) by Cathodic Arc Evaporation (CAE) method in Ringer's solution was studied. The electrochemical appraisal was done by the Potentiodynamic Polarization (PDP) and Electrochemical Impedance Spectroscopy (EIS) tests. Results of PDP tes...

Investigation on multilayered chemical vapor deposited Ti/TiN films as the diffusion barriers in Cu and Al metallization